distant areas: Static units are usually located remotely, escalating Charge and lowering In general process efficiency.
thirty% of its peak ability usage, providing our customers significant reduction in operating prices and enhanced reliability.
the knowledge beneath is classified by semiconductor system and Instrument manufacturer. Each and every table features an apps Matrix that demonstrates qulified and industrial processes.
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LAUDA-Noah will, for the consumer's retrofit analysis, monitor and modify its fluid temperature control profiles to match an present TCUs' as a way to guarantee a smooth method integration by using DAQ.
The accuracy in the POU 3300 allows for impartial control of the process fluid temperature into the wafer chuck inside of +/- 0.one °C of set level, and the rapid response time on the method lets for optimum wafer-to-wafer repeatability all through the etch procedure.
All static TCUs involve excessive cooling & heating capacities because of their quite big course of action fluid reservoirs. The process fuid reservoir on LAUDA-Noah's dynamic temperature Handle procedure is lower than 1 gallon.
With our device strategically mounted about six feet within the chamber, we reach a way more precise reading through with the chuck temperature. This technique guarantees consistent temperature throughout the manufacturing ton, bringing about improved wafer-to-wafer CD uniformity.
significant Footprint: Static models occupy sizeable Room within the fabrication Instrument space, cutting down its effectiveness.
Dynamic Temperature Control, as implemented in devices similar to the LAUDA-Noah POU, is really an check here tactic that senses the temperature of the procedure fluid coming back from the method chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of the supplied process fluid determined by this genuine-time comments.
the information set Here's from a 200mm volume production wafer fab and clearly illustrates the benefit of the LAUDA-Noah POU technique.
The POU3300 program features dynamic temperature Charge of the procedure chamber cathode / electrode / anode and might be synchronized with any etch method.
the fact is always that real Dynamic Temperature Management can only be realized when all five (5) of the next system design and style and set up needs are satisfied:
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We have to have a lot less cooling/heating capability for a similar software as being a static TCU on account of our small reservoir volume.